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NUP4105MU Low Capacitance ESD Protection Array for High Speed Data Lines Protection
The NUP4105MU transient voltage suppressor is designed to protect high speed data lines from ESD, EFT, and lighting.
Features http://onsemi.com
* Low Capacitance (5 pF Maximum Between I/O Lines and GND) * ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model * * * * * * *
and Class C (Exceeding 400 V) per Machine Model Protection for the Following IEC Standards: IEC 61000-4-2 (ESD) Level 4 - 18 kV (Contact) This is a Pb-Free Device High Speed Communication Line Protection USB 1.1 and 2.0 Power and Data Line Protection Digital Video Interface (DVI) Monitors and Flat Panel Displays T1/E1 and T3/E3
LOW CAPACITANCE DIODE TVS ARRAY
PIN CONFIGURATION AND SCHEMATIC
Typical Applications
1 2 3 4 5
10 9 8 7 6
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Peak Power Dissipation Maximum Peak Pulse Current 8 x 20 mS @ TA = 25C (Note 1) Operating Junction Temperature Range Storage Temperature Range Lead Solder Temperature - Maximum (10 Seconds) Human Body Model (HBM) Machine Model (MM) IEC 61000-4-2 Contact (ESD) Symbol Ppk IPP TJ Tstg TL ESD Value 450 26 -40 to +125 -55 to +150 260 16000 400 18000 Unit W A C C C V UDFN10 CASE 517AN 4105 AA Y W G
MARKING DIAGRAM
4105 AAYW G
= Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
Device NUP4105MUTAG Package UDFN10 (Pb-Free) Shipping 3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non-repetitive current pulse per Figure 1 (Pin 5 to GND Pad)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
April, 2009 - Rev. 1
1
Publication Order Number: NUP4105MU/D
NUP4105MU
ELECTRICAL CHARACTERISTICS (TJ=25C unless otherwise specified)
Parameter Reverse Working Voltage Breakdown Voltage Reverse Leakage Current Clamping Voltage Clamping Voltage Clamping Voltage Maximum Peak Pulse Current Junction Capacitance Junction Capacitance Symbol VRWM VBR IR VC VC VC IPP CJ CJ (Note 2) IT=1 mA, (Note 3) VRWM = 3.3 V IPP = 1 A (Note 4) IPP = 10 A (Note 4) IPP = 25 A (Note 4) 8x20 ms Waveform VR = 0 V, f=1 MHz between I/O Pins and GND VR = 0 V, f=1 MHz between I/O Pins 3.0 1.5 5.0 5.3 5.0 6.2 10 14 26 5.0 3.0 Conditions Min Typ Max 3.3 Unit V V mA V V V A pF pF
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 3. VBR is measured at pulse test current IT. 4. Non-repetitive current pulse per Figure 1 (Pin 5 to GND Pad)
TYPICAL PERFORMANCE CURVES
(TJ = 25C unless otherwise noted)
100 PEAK POWER DISSIPATION (%) % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200
100 90 80 70 60 50 40 30 20 10 0 0
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
tP
20
40 t, TIME (ms)
60
80
TA, AMBIENT TEMPERATURE (C)
Figure 1. Pulse Derating Curve
Figure 2. 8 x 20 ms Pulse Waveform
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2
NUP4105MU
PACKAGE DIMENSIONS
UDFN10 2.6x2.6, 0.5P CASE 517AN-01 ISSUE O
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.20 0.30 2.60 BSC 2.00 2.25 2.60 BSC 1.11 1.36 0.50 BSC 0.20 --0.30 0.40
PIN ONE REFERENCE
E
2X 2X
0.10 C
0.10 C
0.10 C
10X
0.08 C
NOTE 4
10X
L
10X
K e
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
III III III
D2
1 10
TOP VIEW A3 A
SIDE VIEW
A1 C
SEATING PLANE
SOLDERING FOOTPRINT*
2.25
5
E2
10X
0.58 1.42 2.90
6
10X
b 0.10 C A 0.05 C
B 0.30
10X
BOTTOM VIEW
NOTE 3
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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3
NUP4105MU/D

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